Isophthalic DMC Resin
SPR 301 DMCIsophthalic dough moulding compound resin for hot-mould processingSPR 301 · Isophthalic Polyester Resins
Isophthalic resin for hot-mould dough-moulding-compound processing.
Review the official product data sheet for specifications and application information.
Price
Price on Request
Industrial resin pricing varies based on:
- Order Quantity
- Resin Grade
- Current Raw Material Rates
Product details
| Catalogue Code | SPR 301 DMC (combined SMC / DMC entry) |
|---|---|
| Resin Chemistry | Isophthalic unsaturated polyester |
| Compound Type | Dough moulding compound (DMC) |
| Supply Condition | Non-accelerated |
| Reference Cure System | MEKP 1.5% + Cobalt Octoate 0.4% — added separately during use |
Typical specification
| Appearance | Clear, pale-yellow to light-amber liquid |
|---|---|
| Viscosity | 800–1,400 cPs at 25 °C |
| Gel Time | 12–18 minutes at 25 °C |
| Specific Gravity | 1.10–1.14 |
| Styrene Content | 31–36% by weight |
Typical values from the Samrat Poly Resins product catalogue, 2026 edition. They are not guaranteed specifications or finished-component properties; confirm the current values for your order and trial the grade on your own process.
SPR 301 DMC is the isophthalic dough moulding compound resin of the SPR 301 family, for hot-mould DMC processing, listed for dough moulding compound production and compression-moulded composite components. The catalogue describes it as a separate manufactured product from the isophthalic SMC resin, sharing the same typical specification. It is supplied non-accelerated, with MEKP and cobalt octoate added separately during use.
The sheet moulding compound product is Isophthalic SMC Resin. The orthophthalic grade is DMC/SMC Resin; the terephthalic grade is Terephthalic DMC Resin.
Key features
- Isophthalic resin for dough moulding compound (SPR 301 DMC)
- For hot-mould DMC processing
- A separate manufactured product from the SMC resin, per the catalogue
- Typical viscosity 800–1,400 cPs; gel time 12–18 minutes at 25 °C
Applications
- Dough moulding compound production
- Compression-moulded composite components
Product role
Dough moulding compound is a bulk, dough-form mix of resin, filler and short fibre, compression- or transfer-moulded into electrical housings, fittings and other compact parts. It is a different compound form from SMC, which is why the catalogue lists the isophthalic DMC resin as its own product even though it shares the SMC resin's typical specification.
Compound formulation and moulding conditions belong to the compounder. Share the compound type, the moulded part and any governing specification when enquiring.
Supply and cure
- Supply condition
- Non-accelerated
- Reference cure system
- MEKP 1.5% + Cobalt Octoate 0.4% — added separately during use
Processes and where this grade fits
SPR 301 DMC is a compound resin for dough moulding compound: resin, filler and short fibre mixed into a dough and moulded under heat and pressure.
| Process or use | Role of this grade | What to confirm |
|---|---|---|
| DMC / BMC dough mixing | Listed role | Mixer type, filler loading, fibre length and dough consistency |
| Compression moulding of DMC parts | Listed role | Tool temperature, charge weight and press cycle |
| Transfer or injection moulding of dough compounds | Process to confirm | Flow of the compound and the equipment used |
| SMC sheet production | Consider SPR 301 SMC | The separate isophthalic SMC product |
Process-selection considerations
- Choose the DMC resin family by the chemistry the moulded part needs; orthophthalic, isophthalic and terephthalic DMC resins are all in the catalogue.
- Describe the part: electrical housing, fitting, component with water exposure, or appearance part.
- Viscosity is 800–1,400 cPs at 25 °C typical; confirm dough behaviour at your filler loading.
- The typical gel time, 12–18 minutes at 25 °C, is an ambient QC figure. Moulding cure comes from the compound initiator and tool heat.
- Share compound storage and shelf requirements for the dough, which belong to the compound design.
Limitations and trial requirements
- SPR 301 DMC shares its typical specification with SPR 301 SMC in the catalogue’s combined entry; no separate DMC-only values are published.
- No moulded-part electrical, mechanical or flammability data are published for the resin.
- The reference cure MEKP 1.5% with cobalt octoate 0.4% is the ambient QC condition.
- Trial the grade on the real part, mould and shop conditions before production. The catalogue values are typical liquid-resin properties, not guaranteed limits or finished-part performance.
Before you select this grade
- The values on this page are typical. Final selection should be confirmed against your own process, a trial result and the current technical documentation for the grade.
- The Technical Data Sheet linked on this page carries these same typical values. No Safety Data Sheet is published on this site for this grade; request current safety information before use.
- Never mix a concentrated peroxide initiator directly with a cobalt accelerator. Add each to the resin separately, according to the confirmed process.
- Store resin, initiators and accelerators separately, in original sealed containers, cool, shaded and away from heat and ignition sources. Use suitable personal protective equipment and adequate ventilation.
